《Table 2 Results of statistical analysis for the mean IMC thickness in the SAC305/Cu and SAC305/Ni-W

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《Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging》

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where Lt is the average thickness of the IMC layer at aging time t，L0 is the initial thickness before aging，k is the growth rate constant，which is strongly related to the diffusion coefficient of atomic elements of the IMCs，and can be obtained from the linear regression line in this figure[2].The diffusion-controlled mechanism could express with this equation during aging process.From this equation，the value of k related to the total thickness of IMC layer at 150℃for SAC305/Cu and SAC305/Ni-W-P/Cu solder joints brazed at 250℃for 10 min was found to be 0.205 09and 0.289 4μm/h1/2（equal to 5.697×10-17 and 8.03×10-17 m2/s），respectively，as shown in Fig.7 and Table 2.Under the same condition，the values of k related to the Cu6Sn5 and Cu3Sn layers are 0.088 4 and 0.110 67μm/h1/2（equal to 2.456×10-17 and 3.074×10-17 m2/s），as shown in Fig.7 and Table 2.