《Table 1 Composition of the plating bath for electroless Ni-W-P》

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《Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging》

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The Sn-3.5Ag-0.5Cu lead-free alloy was used for the solder and 99.99%pure Cu plate with dimensions of 10×10×2 mm3 was used for the substrate.Some Cu substrates were ecletroless plated with Ni-W-P on the surface，as shown in Fig.1.In Fig.1，a uniform film of Ni-W-P with thickness of 7.2μm was observed on the surface of copper plate.After polishing，the Cu plates were degreased in a 30%water solution of hydrochloric acid HCl，followed by cleaning in acetone and drying in air.When the cleaned Cu substrates were prepared，they were divided into two groups.One group applied SAC305 soldering with prepared Cu substrate；while the other group was disposed with activates fluid（5%water solution of HNO3）one minute.The Ni-W-P will be electroless plated on the surface of the worked substrate by chemical reaction with a pH level of 7.0in water bath at 80℃for 150 minutes.The chemicals in the plating bath were listed in Table 1；the Ni-W-P layer contains P since sodium hypophosphite is used as a reducing agent.