《Tab.5 Comparisons betw een the optimized order and baselines by varying test TSVs》

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《三维集成电路绑定中测试成本缩减的优化堆叠顺序（英文）》

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Tab.5 presents our experimental results of the impact of test TSV on testing costs compared w ith the baseline scheme in sequential stacking.In order to analyze the impact of test TSVs on total test costs，the variable tsv_max，w hich means the maximum test TSVs betw een each tw o layers available，is set to be 50 to 100.The maximum TAM w idth available tam_max is set to be 105，and the maximum test pow er available pow er_max is set to be80.Tab.5 illustrates that compared w ith baseline 1，our proposed stack reordering scheme can reduce test costs by around 13.77%at maximum and 13.32%more or less on average.Compared w ith baseline 2，the optimal order can save the test costs by around 66.33%at maximum and 62%on average.