《INTERNATIONAL SYMPOSIUM ON ADVANCES IN INTERCONNECTION AND PACKAGING BOOK TWO MICROELECTRONIC INTE》
| 作者 | 编者 |
|---|---|
| 出版 | 未查询到或未知 |
| 参考页数 | 582 |
| 出版时间 | 1990（求助前请核对） |
| ISBN号 | 0819404578 — 求助条款 |
| PDF编号 | 812099098（仅供预览，未存储实际文件） |
| 求助格式 | 扫描PDF（若分多册发行，每次仅能受理1册） |
1990《INTERNATIONAL SYMPOSIUM ON ADVANCES IN INTERCONNECTION AND PACKAGING BOOK TWO MICROELECTRONIC INTE》由于是年代较久的资料都绝版了，几乎不可能购买到实物。如果大家为了学习确实需要，可向博主求助其电子版PDF文件。对合法合规的求助，我会当即受理并将下载地址发送给你。
高度相关资料
-
- INTERNATIONAL SYMPOSIUM ON FUTURE TRENDS AND INTERNATIONAL COOPERATION IN MATERIALS SCIENCE RESEARCH
-
- BRITISH PACKAGING TWO
- 1993 HEARST BOOKS INTERNATIONAL
-
- ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK 2
- 1991 MCGRAW-HILL，INC
-
- INTERNATIONAL SYMPOSIUM ON LAELED AND UNLABELED ANTIBODDY IN CANCER DIAGNOSIS AND THERAPY
- 1987 NCI MONOGRAPHS
-
- ADVANCES IN MEDICAL COMPUTING PROCEEDINGS OF THE THIRD INTERNATIONAL SYMPOSIUM ON COMPUTERS IN MEDI
- 1975 CHURCHILL LIVINGSTONE
-
- ACS SYMPOSIUM SERIES 407 POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION
- 1989 AMERICAN CHEMICAL SOCIETY
-
- BRILISH PACKAGING TWO
- 1993 EUROPE INTERNOS BOOKS
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