《MICROELECTRONIC DEVICE AND MULILEVEL INTERCONNECTION TECHNOLOGY》
| 作者 | GIRISH A·DIXIT 编者 |
|---|---|
| 出版 | 未查询到或未知 |
| 参考页数 | 326 |
| 出版时间 | 没有确切时间的资料 |
| ISBN号 | 无 — 求助条款 |
| PDF编号 | 811627298（仅供预览，未存储实际文件） |
| 求助格式 | 扫描PDF（若分多册发行，每次仅能受理1册） |
《MICROELECTRONIC DEVICE AND MULILEVEL INTERCONNECTION TECHNOLOGY》由于是年代较久的资料都绝版了，几乎不可能购买到实物。如果大家为了学习确实需要，可向博主求助其电子版PDF文件。对合法合规的求助，我会当即受理并将下载地址发送给你。
高度相关资料
-
- INTERNATIONAL SYMPOSIUM ON ADVANCES IN INTERCONNECTION AND PACKAGING BOOK TWO MICROELECTRONIC INTE
- 1990
-
- MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA
- 1989 ASM INTERNATIONAL
-
- Microelectronic and Microprocessor-based Systems
- 1985 MACMILLAN PUBLISHERS LTD
-
- CCD'76 3RD INTERNATIONAL CONFERENCE THE TECHNOLOGY AND APPLICATIONS OF CHARGE COUPLED DEVICE SE
- 1976 UNIVERSITY OF EDINBURGH
-
- LAN TO WAN INTERCONNECTION
- 1995 MCGRAW-HILL
-
- ELECTRONIC PACKAGING AND INTERCONNECTION HANDBOOK 2
- 1991 MCGRAW-HILL，INC
-
- Standards For Open Systems Interconnection
- 1988 McGraw-Hill Book Company
-
- MATERIALS AND PROCESSES FOR MICROELECTRONIC SYSTEMS
- THE AMERICAN CERAMIC SOCIETY，INC.
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