《MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA》
| 作者 | Wei T.Shieh 编者 |
|---|---|
| 出版 | ASM INTERNATIONAL |
| 参考页数 | 479 |
| 出版时间 | 1989（求助前请核对） |
| ISBN号 | 无 — 求助条款 |
| PDF编号 | 818102978（仅供预览，未存储实际文件） |
| 求助格式 | 扫描PDF（若分多册发行，每次仅能受理1册） |
1989《MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA》由于是年代较久的资料都绝版了，几乎不可能购买到实物。如果大家为了学习确实需要，可向博主求助其电子版PDF文件（由Wei T.Shieh 1989 ASM INTERNATIONAL 出版的版本） 。对合法合规的求助，我会当即受理并将下载地址发送给你。
高度相关资料
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- PROCEEDINGS OF THE SECOND SYMPOSIUM ON ELECTRODE MATERIALS AND PROCESSES FOR ENERGY CONVERSION AND S
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- MATERIALS AND PROCESSES FOR MICROELECTRONIC SYSTEMS
- THE AMERICAN CERAMIC SOCIETY，INC.
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