《MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA》求取 ⇩
作者 | Wei T.Shieh 编者 |
---|---|
出版 | ASM INTERNATIONAL |
参考页数 | 479 ✅ 真实服务 非骗流量 ❤️ |
出版时间 | 1989(求助前请核对) |
ISBN号 | 无 — 违规投诉 / 求助条款 |
PDF编号 | 818102978(学习资料 勿作它用) |
求助格式 | 扫描PDF(若分多册发行,每次仅能受理1册) |
1989《MICROELECTRONIC PACKAGING TECHNOLOGY Materials and Processes Proceedings of the 2nd ASM INTERNATIONA》由于是年代较久的资料都绝版了,几乎不可能购买到实物。如果大家为了学习确实需要,可向博主求助其电子版PDF文件(由Wei T.Shieh 1989 ASM INTERNATIONAL 出版的版本) 。对合法合规的求助,我会当即受理并将下载地址发送给你。
高度相关资料
- CHEMICAL MECHANICAL LANARIZATION OF MICROELECTRONIC MATERIALS
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- PROCEEDINGS OF THE 2ND INTERNATIONAL SYMPOSIUM ON COAL SOMBUSTION SCIENCE AND TECHNOLOGY
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- TRANSPORT PACKAGING FOR RADIOACTIVE MATERIALS PROCEEDINGS SERIES
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- 1987 International food information Service
- PACKAGING DESIGN GRAPHICS MATERIALS TECHNOLOGY
- 1990 THAMES AND HUDSON
- PROCEEDINGS OF THE SECOND SYMPOSIUM ON ELECTRODE MATERIALS AND PROCESSES FOR ENERGY CONVERSION AND S
- 1987 The Electrochemical Society
- MATERIALS AND PROCESSES FOR MICROELECTRONIC SYSTEMS
- THE AMERICAN CERAMIC SOCIETY,INC.
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