《PROCEEDINGS 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING》
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出版 | 未查询到或未知 |
参考页数 | 547 |
出版时间 | 没有确切时间的资料 |
ISBN号 | 0780348508 — 求助条款 |
PDF编号 | 811624318(仅供预览,未存储实际文件) |
求助格式 | 扫描PDF(若分多册发行,每次仅能受理1册) |

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