《Table 1 Specific surface area of spherical and non-spherical colloidal silica》

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《Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire》

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Besides，the CMP polishing of sapphire wafer by SiO2 is believed to follow a chemical reaction leading to the formation of aluminum silicate dihydrate[20].The layer of aluminum silicate dihydrate is much softer than sapphire wafer itself and easily removed.SiO2 abrasive will be directly involved in the chemical reaction.Nonspherical colloidal silica abrasive has much larger specific surface area than spherical colloidal silica，as shown in Table 1.So，non-spherical abrasive has more chemical active sites than spherical abrasive during CMP process，which makes the chemical reaction easier and further increases the MRR.